Radio frequency identification enabled mirrors

ABSTRACT

A radio frequency identification (RFID) enabled mirror includes a mirror comprising a reflective layer. The reflective layer comprises at least one layer of a metallic material. At least one portion of the reflective layer is removed to form a booster antenna from a remaining portion of the reflective layer. A dielectric coating is applied to the mirror where the reflective layer was removed. The RFID-enabled mirror further includes an RFID chip coupled to the booster antenna.

RELATED APPLICATIONS

This patent application is a continuation of U.S. patent applicationSer. No. 17/188,876 entitled “RADIO FREQUENCY IDENTIFICATION ENABLEDMIRRORS” and filed on Mar. 1, 2021, which is a continuation of U.S.patent application Ser. No. 16/852,889 entitled “RADIO FREQUENCYIDENTIFICATION ENABLED MIRRORS” and filed on Apr. 20, 2020, which is acontinuation of U.S. patent application Ser. No. 16/545,945 entitled“RADIO FREQUENCY IDENTIFICATION ENABLED MIRRORS” and filed on Aug. 20,2019, now issued as U.S. Pat. No. 10,628,728 with an issue date of Apr.21, 2020, which is a continuation of U.S. patent application Ser. No.15/979,232 entitled “RADIO FREQUENCY IDENTIFICATION ENABLED MIRRORS” andfiled on May 14, 2018, now issued as U.S. Pat. No. 10,402,717 with anissue date of Sep. 3, 2019, which is a continuation of U.S. patentapplication Ser. No. 15/633,400 entitled “RADIO FREQUENCY IDENTIFICATIONENABLED MIRRORS” and filed on Jun. 26, 2017, now issued as U.S. Pat. No.9,996,791 with an issue date of Jun. 12, 2018, which is a continuationof U.S. patent application Ser. No. 14/927,426 entitled “RADIO FREQUENCYIDENTIFICATION ENABLED MIRRORS” and filed on Oct. 29, 2015, now issuedas U.S. Pat. No. 9,688,202 with an issue date of Jun. 27, 2017, whichclaims the benefit under 35 U.S.C. § 119(e) to U.S. Provisional PatentApplication No. 62/072,416, entitled “RADIO FREQUENCY IDENTIFICATIONENABLED MIRRORS” filed on Oct. 29, 2014, the disclosures of which areincorporated herein by reference in their entirety as a part of thisdocument.

BACKGROUND 1. Technical Field

The various embodiments described herein are related to wirelessdevices, and more particularly to radio frequency identification (RFID)enabled mirrors.

2. Related Art

Radio frequency identification (RFID) technology plays a significantrole in the regulation of motor vehicles and the provision of relatedservices. For example, modern electronic toll systems (ETSs) and parkinggarages both rely heavily on RFID transponders. Thus, vehicles nowadayscommonly carry an RFID transponder. The RFID transponder can communicatewith RFID readers to provide data (e.g., one or more identifiers) thatallows the ETS or parking authority to identify and/or debit anappropriate account.

The placement of conventional RFID transponders tends to be obtrusive.For example, a conventional RFID transponder may be mounted on thevehicle's windshield or dashboard. As such, the RFID transponder canobstruct the driver's line-of-sight and interfere with the aesthetic ofthe vehicle. Therefore, what is needed is an RFID transponder that canbe integrated as a component of the vehicle.

SUMMARY

Radio frequency identification enabled mirrors are provided.

According to various embodiments, there is provided an RFID-enabledmirror. The RFID-enabled mirror includes a mirror comprising areflective layer, wherein: the reflective layer comprises at least onelayer of a metallic material; at least one portion of the reflectivelayer is removed to form a booster antenna from a remaining portion ofthe reflective layer; and a dielectric coating is applied to the mirrorwhere the reflective layer was removed. The RFID-enabled mirror furtherincludes an RFID chip coupled to the booster antenna.

According to various embodiments, there is provided an RFID-enabledmirror. The RFID-enabled mirror includes a mirror comprising areflective layer, wherein: the reflective layer comprises a dielectriccoating; at least one portion of the reflective layer is removed; and ametallic material is applied to the mirror where the reflective layerwas removed to form a booster antenna. The RFID-enabled mirror furtherincludes an RFID chip coupled to the booster antenna.

Other features and advantages of the present inventive concept should beapparent from the following description which illustrates by way ofexample aspects of the present inventive concept.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects and features of the present inventiveconcept will be more apparent by describing example embodiments withreference to the accompanying drawings, in which:

FIG. 1A illustrates a mirror according to various embodiments;

FIG. 1B illustrates a lateral cross-sectional view of a mirror accordingto various embodiments;

FIG. 2A illustrates an RFID-enabled mirror according to variousembodiments;

FIG. 2B illustrates a lateral cross-sectional view of the RFID-enabledmirror according to various embodiments;

FIG. 3 illustrates an RFID-enabled mirror according to variousembodiments;

FIG. 4 illustrates a multi-frequency RFID-enabled mirror according tovarious embodiments; and

FIG. 5 illustrates a self-declaring system according to variousembodiments.

DETAILED DESCRIPTION

While certain embodiments are described, these embodiments are presentedby way of example only, and are not intended to limit the scope ofprotection. The methods and systems described herein may be embodied ina variety of other forms. Furthermore, various omissions, substitutions,and changes in the form of the example methods and systems describedherein may be made without departing from the scope of protection.

FIG. 1A illustrates a mirror 100 according to various embodiments. FIG.1B illustrates a lateral cross-sectional view of the mirror 100according to various embodiments. Referring to FIGS. 1A-B, the mirror100 includes a substrate layer 110. In various embodiments, thesubstrate 100 can be any suitable transparent or substantiallytransparent material including, for example, but not limited to, glass,acrylic (i.e., polymethyl methacrylate (PMMA)), and polycarbonate (PC).

The mirror 100 further includes a reflective layer 120 that is depositedon top of the substrate layer 110. In some embodiments, the reflectivelayer 120 can include at least one layer of a suitable metal or metalalloy including, for example, but not limited to, aluminum (Al), silver(Ag), and speculum metal (i.e., cooper (Cu) and tin (Sn) alloy).

In some embodiments, the reflective layer 120 can include multiplelayers of the same or different metals. For example, in someembodiments, the reflective layer 120 can include a layer of one metal(e.g., silver (Ag) or aluminum (Al)) deposited on top of the substratelayer 110 followed by a layer of a different metal (e.g., copper (Cu)).

Alternately or in addition, in some embodiments, the reflective layer120 can include a dielectric coating. The dielectric coating can includestacked layers of transparent dielectric material adapted to modify thereflective properties of the substrate layer 110.

The mirror 100 further includes a protective layer 130 that is depositedon top of the reflective layer 120. For example, in some embodiments,the protective layer 130 can include a backing (e.g., paint) that isadapted to prevent exposure of the reflective layer 120 to corrosivesubstances (e.g., moisture, chemicals).

A person having ordinary skill in the art can appreciate that the mirror100 can include additional and/or different components without departingfrom the scope of the present disclosure.

FIG. 2A illustrates an RFID-enabled mirror 200 according to variousembodiments. Referring to FIGS. 1A-B and 2A, the RFID-enabled mirror 200includes the mirror 100. As shown in FIG. 2, in some embodiments, theRFID-enabled mirror 200 can be implemented as a rearview mirror. Aperson having ordinary skill in the art can appreciate that theRFID-enabled mirror 300 can be implemented as any suitable vehiclecomponent (e.g., side view mirror) without departing from the scope ofthe present disclosure.

In various embodiments, a portion of the reflective layer 120 of themirror 100 is selectively removed in order to form a booster antenna210. For example, in some embodiments, the reflective layer 120 caninclude at least one metal or metal alloy layer (e.g., aluminum (Al),silver (Ag), and speculum metal). As such, the reflective layer 120 canbe subject to a selective demetallization procedure adapted to remove aportion of the metal or metal alloy layer. A portion of the metal ormetal alloy layer that remains after the selective demetallizationprocedure corresponds to a silhouette of the booster antenna 210.

One embodiment of a selective demetallization procedure is described indetail in co-owned U.S. Pat. No. 7,034,688 as well as U.S. Pat. No.7,463,154, the disclosures of which are incorporated herein by referencein their entirety. For example, a demetallizing solution (e.g., sodiumhydroxide (NaOH)) can be applied to the reflective layer 120 in order toremove a portion of the metal or metal alloy layer while preserving aportion of the metal or metal alloy layer that corresponds to thebooster antenna 210.

Selectively demetallizing the reflective layer 120 to remove a portionof the metal or metal alloy layer can impair the reflective propertiesof the mirror 100. Thus, in various embodiments, a dielectric coatingcan be applied to substrate layer 110 of the mirror 100 to replace theremoved portion of the metal or metal alloy layer in the reflectivelayer 120. As such, the mirror 100 can further include a dielectricsection 220 providing the same or substantially the same reflectiveproperties as the metal or metal alloy layer that has been removed.

Alternately, in some embodiments, the reflective layer 120 includes adielectric coating that can be subject to a selective metallizationprocedure. For example, a portion of the reflective layer 120 thatcorresponds to a silhouette of the booster antenna 120 can be removedand a suitable metal or metal alloy (e.g., aluminum (Al), silver (Ag),and speculum metal) can be deposited to form the booster antenna 210. Assuch, the mirror 100 includes the metal or metal alloy booster antenna210 and the dielectric section 220 that both provide the same orsubstantially the same reflective properties.

The booster antenna 210 is coupled to the RFID chip 230. For example, asshown in FIG. 2, the booster antenna 210 can be capacitively coupled tothe RFID chip 230 via a first contact 212 and a second contact 214.However, a person having ordinary skill in the art can appreciate thatthe booster antenna 210 can be coupled to the RFID chip 230 in adifferent manner (e.g., inductively) without departing from the scope ofthe present disclosure.

In various embodiments, the booster antenna 310 can be configured toresonate at a suitable frequency band. For example, the booster antenna310 can be adapted to resonate at an ultra-high frequency (UHF) band(e.g., 915 megahertz (MHz)), which enables the RFID-enabled mirror 200to communicate with UHF systems and/or devices including, for example,but not limited to, RFID toll booth readers. Alternately, the boosterantenna 310 can be adapted to resonate at a high frequency (HF) band(e.g., 13.5 MHz), which enables the RFID-enabled mirror 200 tocommunicate with an HF systems and/or device including, for example, butnot limited to, a near field communication (NFC) enabled smartphone.

In some embodiments, the RFID-enabled mirror 200 can be coupled with apower source (not shown). For example, the RFID-enabled mirror 200 caninclude a battery or can be connected to an external power source (e.g.,provided by a vehicle). As such, the RFID-enabled mirror 200 can beconfigured to provide one or more notifications (e.g., visual, audio).According to one exemplary embodiment, the RFID-enabled mirror 200 canbe adapted to provide an audio notification (e.g., beep) and/or visualnotification (e.g., light emitting diode (LED)) when a vehicle passes atoll booth and/or accesses a high occupancy toll (HOT) lane.

In various embodiments, the RFID-enabled mirror 200 can further includea switch 240. The switch 240 can be adapted to control one or moreoperational states of the RFID-enabled mirror 200 including, forexample, but not limited to, activating and deactivating theRFID-enabled mirror 200. For example, in some embodiments, theRFID-enabled mirror 200 can be activated via the switch 240 when asingle occupancy vehicle (SOV) enters HOT lane.

Additional details with respect to the switching mechanism are describedin U.S. Pat. Nos. 8,844,831 and 8,944,337, and U.S. patent applicationSer. Nos. 14/480,458 and 14/578,196, the disclosures of which areincorporated herein by reference in their entirety. For example, in someembodiments, the switch 240 can be adapted to control the operationalstates of the RFID-enabled mirror 200 by changing a position of the RFIDchip 230 relative to the booster antenna 210.

In some embodiments, access to data stored by the RFID-enabled mirror200 may be granted based on one or more security keys. Additionaldetails with respect to security key based access control are describedin U.S. Pat. No. 8,933,807, the disclosure of which is incorporatedherein by reference in its entirety.

Although the booster antenna 210 is shown as a loop antenna, a personhaving ordinary skill in the art can appreciate that the booster antenna210 can have any suitable configuration (e.g., slot antenna) withoutdeparting from the scope of the present disclosure.

FIG. 2B illustrates a lateral cross-sectional view of the RFID-enabledmirror 200 according to various embodiments. Referring to FIGS. 1A-B and2A-B, the reflective layer 120 of the mirror 100 included in theRFID-enabled mirror 200 can be subject to selective demetallization orselective metallization to form the booster antenna 210. A dielectriccoating is applied to the substrate 110 of the mirror 100 where metal ormetal alloy was removed (i.e., selective demetallization) or was notdeposited (i.e., selective metallization) to form the dielectric section220. In various embodiments, the mirror 100 can further include theprotective layer 130, which prevents exposure of the booster antenna 210and the dielectric section 220 to corrosive substances (e.g., moisture,chemicals)

The RFID-enabled mirror 200 further includes the RFID chip 230 coupledwith the booster antenna 210. For example, in some embodiments, the RFIDchip 230 can be coupled (e.g., capacitively) with the booster antenna210 via the first contact 212 and the second contact 214, whichpenetrate through a portion of the protective layer 130. Alternately,the RFID chip 230 can be coupled with the booster antenna 210 in adifferent manner (e.g., inductively) without departing from the scope ofthe present disclosure.

FIG. 3 illustrates an RFID-enabled mirror 300 according to variousembodiments. Referring to FIGS. 1A-B and 3, in some embodiments, theRFID-enabled mirror 300 may be implemented as a side view mirror. Aperson having ordinary skill in the art can appreciate that theRFID-enabled mirror 300 can be implemented as any suitable vehiclecomponent (e.g., a rearview mirror) without departing from the scope ofthe present disclosure.

In various embodiments, the RFID-enabled mirror 300 includes the mirror100. According to one exemplary embodiment, a booster antenna 310 isformed by subjecting the reflective layer 120 of the mirror 100 to aselective demetallization or a selective metallization procedure.

For example, in one embodiment, the booster antenna 310 is formed from aportion of a metal or metal alloy layer of the reflective layer 120 thatremains after the reflective layer 120 is subject to a selectivedemetallization procedure. A dielectric coating is deposited to replacethe removed metal or metal alloy layer. A resulting dielectric section320 provides the same or substantially the same reflective properties asthe metal or metal alloy layer that has been removed.

Alternately, in some embodiments, the booster antenna 310 is formed byremoving a portion of a dielectric coating corresponding to a silhouetteof the booster antenna 310 while preserving the dielectric section 330.Metal or metal alloy is deposited where the dielectric coating has beenremoved to from the booster antenna 310.

In various embodiments, the booster antenna 310 can be configured toresonate at a suitable frequency band (e.g., HF or UHF). The boosterantenna 310 can be coupled (e.g., capacitively) to an RFID chip 330 viaa first contact 312 and a second contact 314. However, the boosterantenna 310 can be coupled to the RFID chip 330 in a different manner(e.g., inductively) without departing from the scope of the presentdisclosure.

In some embodiments, the RFID-enabled mirror 300 can be coupled with apower source (not shown). For example, the RFID-enabled mirror 300 caninclude a battery or can be connected to an external power sourceprovided by a vehicle. As such, the RFID-enabled mirror 300 can beconfigured to provide one or more notifications (e.g., visual, audio).According to one exemplary embodiment, the RFID-enabled mirror 300 canbe adapted to provide an audio notification (e.g., beep) and/or visualnotification (e.g., LED) when a vehicle passes a toll booth and/oraccesses an HOT lane.

Although the booster antenna 310 is shown as a loop antenna, a personhaving ordinary skill in the art can appreciate that the booster antenna210 can have any suitable configuration (e.g., slot antenna) withoutdeparting from the scope of the present disclosure.

FIG. 4 illustrates a multi-frequency RFID-enabled mirror 400 accordingto various embodiments. Referring to FIGS. 1A-B and 4, themulti-frequency RFID-enabled mirror 400 can be implemented as a rearviewmirror. A person having ordinary skill in the art can appreciate thatthe RFID-enabled mirror 300 can be implemented as any suitable vehiclecomponent (e.g., side view mirror) without departing from the scope ofthe present disclosure.

In various embodiments, the multi-frequency RFID-enabled mirror 400 caninclude the mirror 100. The mirror 100 can be subject to a selectivedemetallization procedure or a selective metallization procedure to forma booster antenna 420. In some embodiments, the booster antenna 420 canbe a slot antenna having a plurality of slots including, for example,but not limited to, a first slot 412 and a second slot 414.

For example, in some embodiments, the reflective layer 120 of the mirror100 can include a metal or a metal alloy layer (e.g., silver (Au),aluminum (Al), or speculum metal). To form the first slot 412 and thesecond slot 414, silhouettes corresponding to the first slot 412 and thesecond slot 414 can be selectively removed from the reflective layer120. To preserve the reflective qualities of the mirror 100, adielectric coating can be applied on the substrate layer 110 in thefirst slot 412 and the second slot 414 where the reflective layer 120 ofthe mirror 100 was removed. As such, the mirror 100 can include thebooster antenna 420, which has a plurality of dielectric slots (e.g.,the first slot 412 and the second slot 414).

Alternately, in some embodiments, the reflective layer 120 of the mirror100 can include a dielectric coating. As such, a portion of thereflective layer 120 can be removed while preserving the first slot 412and the second slot 414. A metal or a metal alloy layer can be depositedwhere the dielectric coating was removed to form the booster antenna420.

An RFID strap 430 can be positioned across one of the plurality of slots(e.g., the second slot 414) and coupled with the booster antenna 420.For example, in some embodiments, the RFID strap 430 can be coupled(e.g., capacitively) with the booster antenna 420 via a first contact432 and a second contact 434. However, the RFID strap 430 can also becoupled with booster antenna 420 in a different manner (e.g.,inductively) without departing from the scope of the present disclosure.

According to one exemplary embodiment, the multi-frequency RFID-enabledmirror 400 is adapted to support a plurality of frequency bands. Thus,in various embodiments, the relative and respective dimensions, spacing,and location of each of the plurality of slots (e.g., the first slot 412and the second slot 414) are configured such that the booster antenna420 resonates at multiple frequency bands. For example, the boosterantenna 420 can be adapted to resonate at a UHF band (e.g., 915 MHz) andat an HF band (e.g., 13.5 MHz). As such, the multi-frequencyRFID-enabled mirror 400 is able to communicate with multiple RFIDsystems and/or devices including, for example, but not limited to, UHFsystems or devices (e.g., RFID toll booth readers) and/or HF systems ordevices (e.g., an NFC-enabled smartphone).

For example, in some embodiments, the multi-frequency RFID-enabledmirror 400 is able to communicate with UHF RFID readers installed attoll booths and parking garages. The multi-frequency RFID-enabled mirror400 is further able to communicate with an NFC-enabled device (e.g.,smartphone). As such, the multi-frequency RFID-enabled mirror 400 canprovide data (e.g., one or more identifiers) to the UHF RFID readersthat allow the ETS system or parking authority to identify and debit anappropriate account. The multi-frequency RFID-enabled mirror 400 canfurther provide data (e.g., one or more identifiers) to the NFC-enableddevice allowing the NFC-enabled device to recharge the account (e.g.,via an electronic wallet application). Additional details with respectto account management are described in U.S. patent application Ser. No.14/459,299, the disclosure of which is incorporated herein by referencein its entirety.

In some embodiments, the multi-frequency RFID-enabled mirror 400 can becoupled with a power source (not shown). For example, themulti-frequency RFID-enabled mirror 400 can include a battery or can beconnected to an external power source provided by a vehicle. As such,the multi-frequency RFID-enabled mirror 400 can be configured to provideone or more notifications (e.g., visual, audio). According to oneexemplary embodiment, the multi-frequency RFID-enabled mirror 400 can beadapted to provide an audio notification (e.g., beep) and/or visualnotification (e.g., LED) when a vehicle passes a toll booth and/oraccesses an HOT lane.

In various embodiments, the multi-frequency RFID-enabled mirror 400 canfurther include a switch 440. The switch 440 can be adapted to controlone or more operational states of the multi-frequency RFID-enabledmirror 400 including, for example, but not limited to, activating anddeactivating the multi-frequency RFID-enabled mirror 400 with respect toat least one of the plurality of frequency bands (e.g., UHF, HF)supported by the multi-frequency RFID-enabled mirror 400.

Although the multi-frequency RFID-enabled mirror 400 is shown with thefirst slot 412 and the second slot 414, a person having ordinary skillin the art can appreciate that the multi-frequency RFID-enabled mirror400 can include a different number of slots without departing from thescope of the present disclosure. Moreover, the multi-frequencyRFID-enabled mirror 400 can include a plurality of slots (e.g., thefirst slot 412 and the second slot 414) having a different relative andrespective dimension, spacing, and/or location than shown withoutdeparting from the scope of the present disclosure.

Additional details with respect to multi-frequency RFID devices aredescribed in Reissued U.S. Pat. Nos. RE 43,335 and RE 44,691, thedisclosures of which are incorporated by reference herein in theirentirety.

FIG. 5 illustrates a self-declaring system 500 according to variousembodiments. Referring to FIGS. 1A-B, 2A, 3, and 4, the self-declaringsystem 500 can include a sensor module 510, a microcontroller 520, andan RFID-enabled mirror 530. In various embodiments, the RFID-enabledmirror 530 can be implemented by the RFID enabled mirror 200, theRFID-enabled mirror 300, or the multi-frequency RFID-enabled mirror 400.

In various embodiments, the sensor module 510 can collect data that maybe used to determine a number of occupants in a vehicle. For example, insome embodiments, the sensor module 1510 can include one or more sensorsincluding, for example, but not limited to, a motion sensor, an infrared(IR) sensor, and an image recognition sensor.

In various embodiments, the sensor module 510 can transmit at least someof the collected data to the microcontroller 520. According to oneexemplary embodiment, the micro controller 520 can be configured todetermine a number of occupants in the vehicle based on the sensor data.In some embodiments, the microcontroller 520 can further determinewhether the number of occupants in the vehicle exceeds a minimum numberof occupants required for high occupancy vehicle (HOV) lane access in agiven jurisdiction. For example, the micro controller 520 can determine,based on the sensor data, whether the vehicle is an SOV or an HOV.

In various embodiments, the microcontroller 520 is configured to controlan operational state of the RFID-enabled mirror 530. For example, insome embodiments, the microcontroller 520 can change the operationalstate (e.g., activate and deactivate) of the RFID-enabled mirror 530based on occupancy data. If the number of occupants in the vehicle doesnot exceed a certain number (e.g., one), the microcontroller 520 can beconfigured to activate the RFID-enabled mirror 530. Activating theRFID-enabled mirror 530 allows the RFID-enabled mirror 530 tocommunicate relevant data to an HOT lane reader (e.g., one or moreidentifiers allowing the ETS to identify and debit an appropriate tollaccount).

A person having ordinary skill in the art can appreciate that the sensormodule 510, the micro controller 520, and the RFID-enabled mirror 530can be coupled via one or more wired and/or wireless connections withoutdeparting from the scope of the present inventive concept. As such, insome embodiments, the sensor module 510, the micro controller 520, andthe RFID-enabled mirror 530 may be installed in separate locations on avehicle.

The accompanying claims and their equivalents are intended to cover suchforms or modifications as would fall within the scope and spirit of theprotection. For example, the example apparatuses, methods, and systemsdisclosed herein can be applied wireless communication devicesincorporating HF and/or UHF RFID reader capabilities. The variouscomponents illustrated in the figures may be implemented as, forexample, but not limited to, software and/or firmware on a processor,ASIC/FPGA/DSP, or dedicated hardware. Also, the features and attributesof the specific example embodiments disclosed above may be combined indifferent ways to form additional embodiments, all of which fall withinthe scope of the present disclosure.

The foregoing method descriptions and the process flow diagrams areprovided merely as illustrative examples and are not intended to requireor imply that the steps of the various embodiments must be performed inthe order presented. As will be appreciated by one of skill in the artthe order of steps in the foregoing embodiments may be performed in anyorder. Words such as “thereafter,” “then,” “next,” etc. are not intendedto limit the order of the steps; these words are simply used to guidethe reader through the description of the methods. Further, anyreference to claim elements in the singular, for example, using thearticles “a,” “an” or “the” is not to be construed as limiting theelement to the singular.

The various illustrative logical blocks, modules, circuits, andalgorithm steps described in connection with the embodiments disclosedherein may be implemented as electronic hardware, computer software, orcombinations of both. To clearly illustrate this interchangeability ofhardware and software, various illustrative components, blocks, modules,circuits, and steps have been described above generally in terms oftheir functionality. Whether such functionality is implemented ashardware or software depends upon the particular application and designconstraints imposed on the overall system. Skilled artisans mayimplement the described functionality in varying ways for eachparticular application, but such implementation decisions should not beinterpreted as causing a departure from the scope of the presentinvention.

The hardware used to implement the various illustrative logics, logicalblocks, modules, and circuits described in connection with the aspectsdisclosed herein may be implemented or performed with a general purposeprocessor, a digital signal processor (DSP), an application specificintegrated circuit (ASIC), a field programmable gate array (FPGA) orother programmable logic device, discrete gate or transistor logic,discrete hardware components, or any combination thereof designed toperform the functions described herein. A general-purpose processor maybe a microprocessor, but, in the alternative, the processor may be anyconventional processor, controller, microcontroller, or state machine. Aprocessor may also be implemented as a combination of receiver devices,e.g., a combination of a DSP and a microprocessor, a plurality ofmicroprocessors, one or more microprocessors in conjunction with a DSPcore, or any other such configuration. Alternatively, some steps ormethods may be performed by circuitry that is specific to a givenfunction.

In one or more exemplary aspects, the functions described may beimplemented in hardware, software, firmware, or any combination thereof.If implemented in software, the functions may be stored as one or moreinstructions or code on a non-transitory computer-readable storagemedium or non-transitory processor-readable storage medium. The steps ofa method or algorithm disclosed herein may be embodied inprocessor-executable instructions that may reside on a non-transitorycomputer-readable or processor-readable storage medium. Non-transitorycomputer-readable or processor-readable storage media may be any storagemedia that may be accessed by a computer or a processor. By way ofexample but not limitation, such non-transitory computer-readable orprocessor-readable storage media may include RAM, ROM, EEPROM, FLASHmemory, CD-ROM or other optical disk storage, magnetic disk storage orother magnetic storage devices, or any other medium that may be used tostore desired program code in the form of instructions or datastructures and that may be accessed by a computer. Disk and disc, asused herein, includes compact disc (CD), laser disc, optical disc,digital versatile disc (DVD), floppy disk, and Blu-ray disc where disksusually reproduce data magnetically, while discs reproduce dataoptically with lasers. Combinations of the above are also includedwithin the scope of non-transitory computer-readable andprocessor-readable media. Additionally, the operations of a method oralgorithm may reside as one or any combination or set of codes and/orinstructions on a non-transitory processor-readable storage mediumand/or computer-readable storage medium, which may be incorporated intoa computer program product.

Although the present disclosure provides certain example embodiments andapplications, other embodiments that are apparent to those of ordinaryskill in the art, including embodiments which do not provide all of thefeatures and advantages set forth herein, are also within the scope ofthis disclosure. Accordingly, the scope of the present disclosure isintended to be defined only by reference to the appended claims.

What is claimed is:
 1. A method for forming at least one antenna for aradio frequency identified (RFID) enabled mirror, comprising: depositinga reflective layer on a substrate; selectively removing at least aportion of the reflective layer to form the at least one antenna; andapplying a dielectric coating to the substrate to replace the removed atleast a portion of the reflective layer.
 2. The method of claim 1,further comprising depositing a protective layer on the reflectivelayer.
 3. The method of claim 2, where the protective layer includes abacking adapted to prevent exposure of the reflective layer to corrosivesubstances.
 4. The method of claim 1, further comprising coupling anRFID chip to the at least one antenna via one of inductive coupling andcapacitive coupling.
 5. The method of claim 1, wherein the at least oneantenna comprises at least one of a loop antenna and slot correspondingto the removed portion of the reflective layer.
 6. The method of claim1, wherein removing the at least a portion of the reflective layercomprises selectively removing a first portion and a second portion ofthe reflective layer to form a first antenna and a second antenna. 7.The method of claim 6, wherein the first antenna is configured toresonate at a first frequency band and the second antenna is configuredto resonate at a second frequency band.
 8. The method of claim 1,wherein the substrate is one of glass, acrylic, and polycarbonate. 9.The method of claim 1, wherein the reflective layer comprises a layer ofa first metal deposited on top of the substrate followed by a layer of asecond metal different from the first metal.
 10. The method of claim 1,wherein dielectric coating includes stacked layers of transparentdielectric material adapted to modify the reflective properties of thesubstrate.
 11. The method of claim 1, wherein the dielectric coatingcomprises substantially the same reflective properties as the reflectivelayer.
 12. The method of claim 1, wherein selectively removing the atleast a portion of the reflective layer comprises applying ademetallizing solution to the reflective layer to remove the at least aportion of the reflective layer while preserving the remaining portionof the reflective layer that corresponds to the at least one antenna.13. A method for forming at least one antenna for a radio frequencyidentified (RFID) enabled mirror, comprising: depositing a reflectivelayer on a substrate, the reflective layer comprises a dielectriccoating; selectively removing at least a portion of the reflective layercorresponding to the at least one antenna; and depositing a metallicmaterial where the at least a first portion was removed to form the atleast one antenna.
 14. The method of claim 13, further comprisingdepositing a protective layer on the reflective layer.
 15. The method ofclaim 14, where the protective layer includes a backing adapted toprevent exposure of the reflective layer to corrosive substances. 16.The method of claim 13, further comprising coupling an RFID chip to theat least one antenna via one of inductive coupling and capacitivecoupling.
 17. The method of claim 13, wherein the at least one antennacomprises at least one of a loop antenna and a slot corresponding to theremoved portion of the reflective layer.
 18. The method of claim 13,wherein removing the at least a portion of the reflective layercomprises selectively removing a first portion and a second portion ofthe reflective layer corresponding to a first antenna and a secondantenna, respectively.
 19. The method of claim 18, wherein the firstantenna is configured to resonate at a first frequency band and thesecond antenna is configured to resonate at a second frequency band. 20.The method of claim 13, wherein the substrate is one of glass, acrylic,and polycarbonate.
 21. The method of claim 13, wherein dielectriccoating includes stacked layers of transparent dielectric materialadapted to modify the reflective properties of the substrate.
 22. Themethod of claim 13, wherein the dielectric coating comprisessubstantially the same reflective properties as the metallic material.